Ozone Wafer Cleaning Process "SicOzone CLEAN"
Replace hydrogen peroxide with ozone! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.
Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 - Reduces chemical costs by using ozone instead of hydrogen peroxide for conventional RCA cleaning. - No special specifications are required as it does not use high-concentration ozone water. - Integrates with other wet processes such as etching and resist stripping, allowing multiple processing steps to be carried out without moving the wafers. - Ozone decomposes easily, reducing waste disposal costs. - Installation area of less than 2m². - Capable of using chambers for 25 or 50 wafers. *For more details, please refer to the PDF document or feel free to contact us.
- Company：Siconnex Japan(サイコネックス ジャパン)
- Price：Other
